Slag is metallic impurities formed on the solder surface. These substances are formed by the oxidation of Tin and Lead as a result of contact with air. Slag formation depends on the shape and properties of the solder pot. For example, the area of the solder surface in contact with the air, whether the wave flows regularly or not. As the amount of slag in a ladle increases, the rate of oxidation and thus the formation of new slag accelerates. For this reason, the accumulated slag should be cleaned frequently and the decreasing solder level should be brought to the required level with additional solder.

The dross also damages the soldering process and the solder wave. If the solder accumulates as much as the pump can pull, it quickly wears the pump assembly. In addition, the soldering wave runs unevenly and the soldering uniformity is lost. Large pieces of slag stick to the bottom of the printed circuit boards, causing short circuit and a~ formation.

Use SOLDEX Slag Release Powder to minimize the amount of solder accumulating as slag in the solder pot.



Approximate Length of 1kg Soldering Wire (m)

  Sn60 Pb40   Sn63 Pb37   Sn99,3 Cu0,7   Sn96,5 Ag3 Cu0,5
Tel Çapı 1m Ağırlık 1kg Uzunluk   1m Ağırlık 1kg Uzunluk   1m Ağırlık 1kg Uznluk   1m Ağırlık 1kg Uzunluk
0,50mm 1,59gr 628m                  
0,75mm 3,66gr 273m   3,60gr 278m   3,05gr 328m      
1,00mm 6,48gr 154m   6,40gr 156m         5,37gr 186m
1,20mm 8,80gr 114m   8,70gr 115m   7,49gr 134m      

To Calculate the Length of 1kg Soldering Wire;
To calculate the approximate length of 1kg of solder wire, we weigh 1m of solder wire.
1.000gr ÷ Weighing Result (1m Wire Weight) = 1kg Solder Wire Length

The dimensions given here are valid for SOLDEX Soldering Wires and the measurement is presented theoretically. It does not specify absolute values.


SOLDERING STANDARDS British BS 219 Grade KP U.S.ASTM Grade A German DIN 1707 Japan JIS Z-3283
Cu Copper 0,08% 0,06% 0,08% 0,05%
Bi Bismuth 0,1% 0,25% 0,25% 0,05%
Fe İron 0,02% 0,02% 0,02% 0,02%
Ag Silver No Limit No Limit No Limit No Limit
Cd Kadmiyum 0,05% No Limit   No Limit
Al Aluminum 0,001% 0,005% 0,005 Total% 0,005%
Zn Zink 0,003% 0,005%   0,005%
Sb Antimuan 0,2% 0,12% 0,12% 0,3%
As Arsenic 0,03% 0,02% 0,02% 0,03%
P Phosphorus        
S Sulfur Zaralı
O Oxide        
Au AGold 0,08% No Limit 0,08% No Limit



Soldering Methods
For a good soldering, the surface should be clean and the soldering operation should be completed in about 2 seconds on electronic parts. After electronic soldering, the soldering elements must be visible and bridged with the component feet, the soldering surface must be shiny. It is very important for the soldering quality that the solder alloy used is pure and within the framework of standards. High purity imported, test certified A Grade tin and lead raw materials are used in SOLDEX solder rods and wires.



1.1 Soldering iron
1.2 Heat transfer in preheated blocks
1.3 Roller transfer




2.1 Dip
2.2 Wave
2.3 Dragging
2.4 Ultrasound
2.5 Surface bonding
3 3.1 Flame
3.2 Hot