PRODUCTS
Tube Solder
Lead Free Rod All...
Resinous Flux Asr...
Lead Free Cream S...
Isopropyl Alcohol
Solder Remover St...
Leaded Cream Sold...
Arax Flux
Sn40 Pb60 Leaded...
Sn63 Pb37 Leaded...
Lead Free Solderi...
Leaded Rod Solder
Arax Paste Solder...
Soldex Solder Pas...
Sn60 Pb40 No Clea...
No Clean Liquid F...
Sn60 Pb40 No Clean Solder Wire
Soldering wires containing X39 flux are especially formulated as a complement to clean wave and reflow soldering operations.
Soldex Slag Decomposing Powder
CAT-1811 Slag Decomposing Powder
It is used to separate the slag formed in the solder pot from the solder.
Stained Glass Soldering Wire (no Paste)
Preferred in stained glass art
DIAMETER: 3-5 mm
PACKAGING: 4 Pieces 3000 gr
Resin Flux Asr-41
Resin Flux Asr-41
It is used for fast soldering of conventional footed and surface mounted components without bridle and fringe.
Sn60 Pb40 Leaded Wire
Sn60 Pb40 Leaded Wire
It is a type of flux-containing wire solder used worldwide for TV, electronics and consumer goods.
Arax Flux
Tube Solder
Cup Type Soldering Pot
Leaded Rod Solder
Leaded Rod Solder
Rod solders are produced from the cleanest metals of the highest purity in a vacuum environment.
Soldex Solder Paste
Soldex Solder Paste
This highly active, non-abrasive paste is especially suitable for electrical and electronic applications with its excellent wetting properties.
Sn40 Pb60 Leaded Wire
Sn40 Pb60 Leaded Wire
Your special orders are taken in the desired diameters between 1.00 mm - 6.00 mm.
Lead Free Cream Solders
Lead Free Cream Solders
The formula is a mildly activated resin-based formulation specially designed to leave post-process residues on PCB without degradation.
PLEASE REQUEST STOCK INFORMATION!
Sn30 Pb70 Leaded Wire
Sn30 Pb70 Leaded Wire
Your special orders are taken in the desired diameters in the range of 1.00 mm-6.00 mm.
Resinous Flux Asr-52
Resinous Flux Asr-52
It is used for fast soldering of conventional footed and surface mounted components without bridle and fringe.
Leaded Cream Solder
Leaded Cream Solder
The formula is a mildly activated resin-based formulation specially designed to leave post-process residues on PCB without degradation.